Silicone-Free Heat Sink Compound MPN:1978-DP

With the ability to draw heat away when applied to a component, this TECHSPRAY silicone-free heat sink compound is generally used to thermally bond a component with a mechanical heat sink. Suitable for use in a variety of electrical applications including use with calrods, thermistors, and thermocouple wells. This easy-to-apply material is non-ozone depleting and it won’t separate, harden, or crack.

• Thermal conductivity: 0.92 W/m-K
• Functional temp. range: -40° to 392°F

Technical Specifications

• Item Silicone-Free Heat Sink Compound
• Size 4 oz

Manufacturer Details

• Manufacturer: Techspray
• Condensed Mfg Number: 1978DP
• MPN: 1978-DP

Label Details

• Hazardous Material: N
• Green Material Flag: N
• Country of Origin: US
• CA Prop 65 Wht Label: N

Classification Details

• GDS Category Name: Heat Sink Compounds
• GDS Family Name: Air Conditioners and Accessories
• GDS Segment Name: HVAC and Refrigeration
• UNSPSC: 32131001
• UNSPSC Class ID: 10
• UNSPSC Commodity Name: Electronic component parts and raw materials and accessories
• UNSPSC Commodity ID: 01
• UNSPSC Commodity Name: Heat sinks
• UNSPSC Family ID: 13
• UNSPSC Family Name: Electronic hardware and component parts and accessories
• UNSPSC Segment ID: 32
• UNSPSC Segment Name: Electronic Components and Supplies

Shipping Details

• Not For Sale In: HI AK PR